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Á¦Ç°¸í ÃÊÀ½ÆÄ µÎ²² ÃøÁ¤±â QuintSonic T




Ultrasonic coating thickness measurement QuintSonic T

Mobie measuring system

Multi-Layer ÃøÁ¤±â °¡´ÉÇÑ ÃÊÀ½Æĵβ²ÃøÁ¤±â QuintSonic 7

Çöó½ºÆ½, ±Ý¼Ó, ¸ñÀç, À¯¸® ¹× ¼¼¶ó¹Í¿¡ µµÆ÷µÈ ÆäÀÎÆ®, ·¡Ä¿ ¹× Çöó½ºÆ½ ÃþÀ» ÃøÁ¤Çϱâ À§ÇÑ ÃÊÀ½ÆÄ µµ¸· µÎ²² ÃøÁ¤±â. ÃÖ´ë ´Ù¼¸ °³ÀÇ ÃþÀ» ºñÆı«½ÄÀ¸·Î Çѹø¿¡ ÃøÁ¤ÇÒ ¼ö ÀÖ½À´Ï´Ù. Çõ½ÅÀûÀÎ ±â¼ú·Î QuintSonic 7 Àº GRP(Glass fiber Reinforced Plastics) ¿Í CRP(Carbon fiber Reinforced Plastics) ¼ººÐÀÇ µÎ²²¸¦ Á¤È®ÇÏ°Ô ÃøÁ¤ÇÒ ¼ö ÀÖ´Â ÃÖÃÊÀÇ µµ¸·°ÔÀÌÁö ÀÔ´Ï´Ù. ƯÈ÷ A-scan ±â´ÉÀº °ÔÀÌÁö¸¦ PC¿¡ ¿¬°á ¾øÀÌ Á÷Á¢ ±â±âÀÇ µð½ºÇ÷¹ÀÌ¿¡¼­ »ç¿ëÀÌ °¡´ÉÇÑ Çõ½ÅÀûÀÎ ±â¼úÀÔ´Ï´Ù. ÀÌ ±â´ÉÀ¸·Î QuintSonic 7Àº ½ÇÇè½ÇÀ̳ª ÇöÀåÀÇ ¾î¶°ÇÑ »óȲ¿¡¼­µµ ½Å·Ú¼º ÀÖ´Â ÃøÁ¤ÀÌ °¡´ÉÇÑ °¡Àå ÀÌ»óÀûÀÎ µµ¸· µÎ²²ÃøÁ¤±â ÀÔ´Ï´Ù. QuintSonic 7Àº ÀÚµ¿Â÷ »ê¾÷ , Ç×°ø±â Á¦Á¶¶Ç´Â °íÁ¤¹ÐÀ» ¿äÇÏ´Â ´Ù¸¥ »ê¾÷¿¡¼­ ´Ù¾çÇÑ Àû¿ëÀÌ °¡´ÉÇÕ´Ï´Ù.


QuintSonic 7 ÀÇ ´ÜÁ¡À̾ú´ø °¢Á¾ ¼³Á¤À» Tablet À» ÀÌ¿ëÇÏ¿© ¿¬±¸¼Ò »Ó ¾Æ´Ï¶ó ÇöÀå¿¡¼­µµ ¹Ù·Î Àû¿ëÇÏ¿© ÃøÁ¤ÇÒ ¼ö ÀÖµµ·Ï ÇÏ¿´½À´Ï´Ù. ºñ Æı«½ÄÀ¸·Î 8°³ÀÇ ÄÚµùÃþÀ» ÃøÁ¤ÇÒ ¼ö ÀÖ½À´Ï´Ù.

PropertyValue
Measuring principle

Ultrasonic pulse run-time method

Measuring range / Resolution / Accuracy

Nr.1 Measuring range 356 µm  Resolution 0,25 µm Accuracy 0,25 µm

Nr.2 Measuring range 890 µm  Resolution 0,5 µm Accuracy 0,5 µm

Nr.3 Measuring range 1.900 µm  Resolution 1 µm Accuracy 1 µm

Nr.4 Measuring range 3.900 µm  Resolution 2 µm Accuracy 2 µm

Nr.5 Measuring range 7.500 µm  Resolution 4 µm Accuracy 4 µm
(at 2375 m/s ultrasonic velocity in all layers)

Minimum layer thickness

approx. 10 µm (depending on the ultrasonic velocity in the layer)

Number of layersup to 8 layers in one operation
Measurement cycle time

approx. 1 s

Measuring area5 mm ¨ª / 0.2" ¨ª
Contact area10 mm ¨ª / 0.4" ¨ª
Minimum curvature radiusconvex: 50 mm / 2" concave: -
Measurement unitsµm, mm, mils
CalibrationSound velocity calibration for up to 8 layers
Statistics

N (number of measurment values) ¡¤ Minimum ¡¤ Maximum ¡¤ Average ¡¤ Standard ¡¤ deviation ¡¤ Coefficient of variation ¡¤ Block statistics (user adjustable) ¡¤ Histogram ¡¤
Trend diagram

Interface

Bluetooth
WiFi
SD-card

International StandardsDIN EN ISO 2808
Signal processingSensor integrated digital 32-bit signal processing (SIDSP¢ç)
Operating temperature5 ¡ÆC - 50 ¡ÆC / 40 ¡Æ F - 122 ¡ÆF
Storage temperature-10 ¡ÆC - 50 ¡ÆC / 14 ¡ÆF - 122 ¡ÆF




 

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